Laser Photonics Launches R&D Initiative to Accelerate Innovation
ORLANDO, Fla. – Laser Photonics Corporation (NASDAQ: LASE) (“LPC”), a leading global developer of industrial laser systems for cleaning and other material processing applications, announced today that it has launched a research and development initiative targeting industrial laser solutions for pharmaceutical tablet drilling, wafer scribing, and semiconductor marking.
“We’re now tapping into more of these market segments with the addition of Control Micro Systems. Its state-of-the-art technology and Orlando-based development team have already proven invaluable.”
Following LPC’s recent acquisition of Control Micro Systems, Inc., the company is dedicating resources to a number of new engineering projects to continue advancing its newly acquired laser systems. This investment of time and expertise, leveraging the innovative technologies and know-how from Control Micro Systems (“CMS”), aims to expand LPC’s footprint in diversified markets.
“Laser technology has reformed material processing across numerous industries,” said Wayne Tupuola, CEO of LPC. “We’re now tapping into more of these market segments with the addition of Control Micro Systems. Its state-of-the-art technology and Orlando-based development team have already proven invaluable.”
New sectors of focus are pharmaceuticals, wafers, and semiconductors. Through the R&D initiative the company will be devoting additional resources to advance its currently available technology to maintain a competitive edge and meet the needs of the market. In the pharmaceutical space, LPC will further develop Control Micro Systems tablet drilling and marking system for time-release medications. This Class I automated CO2 laser system features a custom tablet fixture, fume extraction, and machine vision inspection for quality control, engineered as an anti-counterfeiting solution.
Laser technology for wafer serialization entails the marking, scribing, and lapping of wafers composed of silicon and related compounds. LPC will continue to advance Control Micro Systems multi-station system, which is tailored for wafers up to 300 mm wide and 300 – 800 microns in thickness and features robotic wafer positioning. This technology serves to facilitate the production and tracking of wafers for consumer electronics, solar panels, LEDs, MEMS devices, optoelectronic components, and others.
The third system LPC will continue advancing through this initiative is the semiconductor laser marking system by CMS. This system is engineered with a high-precision ultraviolet laser and a galvanometer scanhead, enabling fast fiducial recognition. This innovative technology produces small permanent markings on IC mold compounds and ceramics with minimal heat, ensuring no damage to the part. Machine vision aids in the verification of chip positioning and marking alignment.
Stay tuned for LPC’s forthcoming announcements, where the company will reveal more details about each system.
About Laser Photonics Corporation
Laser Photonics is a vertically integrated manufacturer and R&D Center of Excellence for industrial laser technologies and systems. Laser Photonics seeks to disrupt the $46 billion, centuries-old sand and abrasives blasting markets, focusing on surface cleaning, rust removal, corrosion control, de-painting and other laser-based industrial applications. Laser Photonics’ new generation of leading-edge laser blasting technologies and equipment also addresses the numerous health, safety, environmental and regulatory issues associated with old methods. As a result, Laser Photonics has quickly gained a reputation as an industry leader in industrial laser systems with a brand that stands for quality, technology and product innovation. Currently, world-renowned and Fortune 1000 manufacturers in the aerospace, automotive, defense, energy, maritime, nuclear and space industries are using Laser Photonics’ “unique-to-industry” systems. For more information, visit https://www.laserphotonics.com.
Cautionary Note Concerning Forward-Looking Statements
This press release contains “forward-looking statements” (within the meaning of Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended), including statements regarding the Company’s plans, prospects, potential results and use of proceeds. These statements are based on current expectations as of the date of this press release and involve a number of risks and uncertainties, which may cause results and uses of proceeds to differ materially from those indicated by these forward-looking statements. These risks include, without limitation, those described under the caption “Risk Factors” in the Registration Statement. Any reader of this press release is cautioned not to place undue reliance on these forward-looking statements, which speak only as of the date of this press release. The Company undertakes no obligation to revise or update any forward-looking statements to reflect events or circumstances after the date of this press release except as required by applicable laws or regulations.
